Corrigendum to “Investigation of kinetics of ECM dendrite growth during corrosion in electronics” [Corros. Sci. 260 (2026) 113575]
Fields of Study & Subjects
Hydrogen embrittlement and corrosion behaviors in metals
Solidification and crystal growth phenomena
Copper Interconnects and Reliability
Publication details
- Journal / source
- Corrosion Science
- Volume
- 261
- Pages
- 113618–113618
- Publication date
- 8 January 2026
- Language
- EN