Uncovering the multi-stage evolution process and corrosion failure mechanism of typical electronic interconnections in condensation environments

Corrosion Science 2026

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Authors: Bingqin Wang, Jialiang Song, Ziheng Zhao, Sen Cong, Meihui Sun, Luntao Wang, Xuequn Cheng, Kui Xiao, Dawei Zhang, Xiaogang Li

DOI: 10.1016/j.corsci.2026.113976

Cited by: 1

References: 43

Fields of Study & Subjects

Electrical Contact Performance and Analysis Copper Interconnects and Reliability Hydrogen embrittlement and corrosion behaviors in metals

References 43