Advances in flexible thermal Interface materials with low contact thermal resistance

Current Opinion in Solid State and Materials Science 2026

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Authors: Yan Zhang, Xin Dai, Zikang Liang, Ming He, Yucan Peng

DOI: 10.1016/j.cossms.2026.101288

Cited by: 1

References: 108

Fields of Study & Subjects

Thermal properties of materials Advanced Thermoelectric Materials and Devices Thermal Expansion and Ionic Conductivity

References 108