A chemical bonding adhesive for PEEK based on aromatic ring interactions

Dental Materials 2026

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Authors: Miki Hori, Kazuo Ohkuma, Tatsushi Kawai, Tatsuhide Hayashi

DOI: 10.1016/j.dental.2026.02.006

Cited by: 0

References: 29

Fields of Study & Subjects

Dental materials and restorations Material Properties and Applications Epoxy Resin Curing Processes

References 29