A 0.25-mm-thick ultra-conductive thermal ground plane for cooling compact electronics

Device 2026

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Authors: Xiuliang Liu, Sha Li, Jiaxuan Liu, Yuxuan Chen, Yuqi Shi, Ronggui Yang

DOI: 10.1016/j.device.2026.101123

Cited by: 1

References: 35

Fields of Study & Subjects

Advanced Thermoelectric Materials and Devices Thermal properties of materials Thermal Radiation and Cooling Technologies

References 35