Wear mechanism of diamond wire in slicing of silicon wafers
Fields of Study & Subjects
Advanced Surface Polishing Techniques
Diamond and Carbon-based Materials Research
Advanced machining processes and optimization
Publication details
- Journal / source
- Diamond and Related Materials
- Publisher
- Elsevier BV
- Volume
- 162
- Pages
- 113284–113284
- Publication date
- 4 January 2026
- Language
- EN