Friction soften mechanism of vacancies in SiC during grinding from atomic perspective

Diamond and Related Materials 2026

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Authors: Yuhua Huang, Bingchen Li, Weicheng Wu, Jiaqi Wan, Kailin Sun, Jinglong Zheng, Ronghong Shangguan, Bin Wang, Bin Wang, Chengxin Wang

DOI: 10.1016/j.diamond.2026.113330

Cited by: 0

References: 26

Fields of Study & Subjects

Advanced Surface Polishing Techniques Advanced machining processes and optimization Force Microscopy Techniques and Applications

References 26