Electroless plating of high-quality Ni microbumps for high-density micro-LEDs realized via surface plasma treatment and solution wettability enhancement

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Authors: Shuaishuai Wang, Zhihua Wang, Peiquan Zheng, Yijian Zhou, Chengwu Wu, Taifu Lang, Xin Lin, Xin Wu, Caihong Yan, Qun Yan, Kaixin Zhang, Jie Sun
Cited by: 1
References: 19

Fields of Study & Subjects

Electrodeposition and Electroless Coatings 3D IC and TSV technologies Nanomaterials and Printing Technologies

Publication details

Journal / source
Displays
Publisher
Elsevier BV
Volume
93
Pages
103370–103370
Publication date
4 February 2026
Language
EN