Potentiostatic electrodeposition of Cu thin films directly on ALD Ru diffusion barrier and trench-filling for Cu interconnect

Electrochimica Acta 2026

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Authors: Byoungyong Im, Sunjung Kim, Sunjung Kim, Soo-Hyun Kim, Soo-Hyun Kim, Kwangsuk Park
DOI: 10.1016/j.electacta.2026.148175
Cited by: 0
References: 55

Fields of Study & Subjects

Copper Interconnects and Reliability Electrodeposition and Electroless Coatings Electronic Packaging and Soldering Technologies

Publication details

Journal / source
Electrochimica Acta
Volume
551
Pages
148175–148175
Publication date
10 January 2026
Language
EN