Fully coupled multi-physics modeling and synergistic structural optimization for high uniformity 8-inch wafer electroplating

Electrochimica Acta 2026

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Authors: Hao Luo, Hu He
DOI: 10.1016/j.electacta.2026.148345
Cited by: 0
References: 26

Fields of Study & Subjects

Electrodeposition and Electroless Coatings Copper Interconnects and Reliability Electronic Packaging and Soldering Technologies

Publication details

Journal / source
Electrochimica Acta
Volume
554
Pages
148345–148345
Publication date
31 January 2026
Language
EN