Machine learning assisted multiphysics simulation for electroplating copper in high aspect ratio through silicon via

Electrochimica Acta 2026

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Authors: Xiaoyue Ding, Wei Li, Yang Xi, Hanwen Cui, Z.H Li, Huai Zheng, Yingxia Liu, Xi Tang, Xinlu Teng, Yikang Zhou, Yuzheng Guo, Sheng Liu

+1 more

Zhaofu Zhang

DOI: 10.1016/j.electacta.2026.148450

Cited by: 2

References: 31

Fields of Study & Subjects

3D IC and TSV technologies Electrodeposition and Electroless Coatings Electronic Packaging and Soldering Technologies

References 31