Research progress on galvanic corrosion mechanisms and suppression strategies in Cu interconnect CMP processes for IC

Electrochimica Acta 2026

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Authors: Yue He, Yadong Zhu, Jianshu Wang, Shihui Huang, Yuke Liu, Baohong Gao

DOI: 10.1016/j.electacta.2026.148458

Cited by: 4

References: 148

Fields of Study & Subjects

Advanced Surface Polishing Techniques Copper Interconnects and Reliability 3D IC and TSV technologies

References 148