Electrochemical migration behavior of Cu interconnects on alumina substrate in Cl- containing solutions

Electrochimica Acta 2026

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Authors: Jinyuan Zhang, Xuyang Yan, Zezhan Li, Yingxuan Ge, Changran Zheng, Chuan Chen, Jiajie Fan
DOI: 10.1016/j.electacta.2026.148898
Cited by: 1
References: 24

Fields of Study & Subjects

Copper Interconnects and Reliability Electronic Packaging and Soldering Technologies Electrodeposition and Electroless Coatings

Publication details

Journal / source
Electrochimica Acta
Publisher
Elsevier BV
Volume
570
Pages
148898–148898
Publication date
20 April 2026
Language
EN