Elastic strain engineering of lattice thermal conductivity of silicon: An ab-initio study

Extreme Mechanics Letters 2026

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Authors: Wencong Shi, Zhe Shi, Lilia M. Woods, Ju Li, Ming Dao
DOI: 10.1016/j.eml.2026.102469
Cited by: 2
References: 25

Fields of Study & Subjects

Thermal properties of materials Thermography and Photoacoustic Techniques Silicon and Solar Cell Technologies

Publication details

Journal / source
Extreme Mechanics Letters
Publisher
Elsevier BV
Volume
84
Pages
102469–102469
Publication date
5 March 2026
Language
EN