Passive two-phase immersion cooling achieving over 1000 W per chip via porous coated flat plate heat pipes
Fields of Study & Subjects
Heat Transfer and Boiling Studies
Heat Transfer and Optimization
Fluid Dynamics and Thin Films
Publication details
- Journal / source
- Energy Conversion and Management
- Publisher
- Elsevier BV
- Volume
- 353
- Pages
- 121237–121237
- Publication date
- 17 February 2026
- Language
- EN