Multi-dimensional performance evaluation and influencing factors study of inter-chip thermal coupling in immersion-cooled heterogeneous multi-chip servers

Energy 2026

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Authors: Yang Lin, Chang Yue, Liping Zeng, Jing Ee Yit, Kamaruzzaman Kamaruzzaman Sopian, Wen Su, Jiaqiang Wang

DOI: 10.1016/j.energy.2026.140127

Cited by: 2

References: 31

Fields of Study & Subjects

Parallel Computing and Optimization Techniques Heat Transfer and Optimization 3D IC and TSV technologies

References 31