Influence of component arrangement on thermal management in immersion-cooled server boards
Fields of Study & Subjects
Heat Transfer and Optimization
Fluid Dynamics and Thin Films
Nanofluid Flow and Heat Transfer
Publication details
- Journal / source
- Energy
- Publisher
- Elsevier BV
- Volume
- 347
- Pages
- 140323–140323
- Publication date
- 10 February 2026
- Language
- EN