A coupled finite element-virtual element method for thermomechanical analysis of electronic packaging structures

Engineering Analysis with Boundary Elements 2026 Open access

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Authors: Yanpeng Gong, Sishuai Li, Yue Mei, Bingbing Xu, Fei Qin, Xiaoying Zhuang, Timon Rabczuk

DOI: 10.1016/j.enganabound.2026.106640

Cited by: 6

References: 41

Fields of Study & Subjects

Numerical methods in engineering Electronic Packaging and Soldering Technologies Composite Structure Analysis and Optimization

References 41