Sequential reflow warpage in SiC hybrid IGBT Modules: Process-Consistent modeling and Mechanism-Based mitigation

Engineering Failure Analysis 2026

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Authors: Jinlan Wang, Peisheng Liu, Lipeng Tan, Jiajie Jin, Yaohui Deng, Zhao Zhang, Feiyu Qiang

DOI: 10.1016/j.engfailanal.2026.110674

Cited by: 2

References: 41

Fields of Study & Subjects

Silicon Carbide Semiconductor Technologies Advanced ceramic materials synthesis Electronic Packaging and Soldering Technologies

References 41