Microchannel cooling for high-performance microelectronic systems: Progress, challenges, and future directions

International Communications in Heat and Mass Transfer 2026

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Authors: Ci Ao, Bo Xu, Zhenqian Chen
DOI: 10.1016/j.icheatmasstransfer.2026.110494
Cited by: 15
References: 189

Fields of Study & Subjects

Heat Transfer and Optimization Heat Transfer and Boiling Studies Thermal properties of materials

Publication details

Journal / source
International Communications in Heat and Mass Transfer
Publisher
Elsevier BV
Volume
172
Pages
110494–110494
Publication date
8 January 2026
Language
EN