Micro joining of stranded Cu conductors and Ag wires in seconds and online monitoring assisted thermal-electric-mechanical modeling
Fields of Study & Subjects
Advanced Welding Techniques Analysis
Electronic Packaging and Soldering Technologies
Welding Techniques and Residual Stresses
Publication details
- Journal / source
- International Communications in Heat and Mass Transfer
- Publisher
- Elsevier BV
- Volume
- 172
- Pages
- 110525–110525
- Publication date
- 9 January 2026
- Language
- EN