Machine learning-driven hotspot thermal management in chip heat sinks through topology optimization
Fields of Study & Subjects
Heat Transfer and Optimization
Thermal properties of materials
Topology Optimization in Engineering
Publication details
- Journal / source
- International Communications in Heat and Mass Transfer
- Publisher
- Elsevier BV
- Volume
- 172
- Pages
- 110632–110632
- Publication date
- 30 January 2026
- Language
- EN