Coupled effects of cracks and interfacial thermal resistance on heat conduction in flip-chip packages

International Communications in Heat and Mass Transfer 2026

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Authors: Tao Wu, Kexing Long, Tao Xue

DOI: 10.1016/j.icheatmasstransfer.2026.110674

Cited by: 3

References: 61

Fields of Study & Subjects

Thermal properties of materials Electronic Packaging and Soldering Technologies Silicon Carbide Semiconductor Technologies

References 61