Flow and heat transfer characteristics of embedded microfluidic cooling in TSV interposer for 2.5D packaging

International Communications in Heat and Mass Transfer 2026

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Authors: Yufan Gong, Shiqi Xu, Yuanle Zhang, Qiang Li, Haojie Huang, Xuemei Chen

DOI: 10.1016/j.icheatmasstransfer.2026.110866

Cited by: 4

References: 28

Fields of Study & Subjects

3D IC and TSV technologies Heat Transfer and Optimization Electronic Packaging and Soldering Technologies

References 28