Junction temperature distributions with hot spots and uniform and non-uniform heat fluxes in direct-to-die passive two-phase immersion cooling

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Authors: Yifang Dong, Ruihai Su, Shiqi Jia, Yuxin Ye, Ruiwen Liu, Wenbin Zhou, Qidong Wang, Binbin Jiao
Cited by: 1
References: 31

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Thermal properties of materials Microstructure and Mechanical Properties of Steels

Publication details

Journal / source
International Communications in Heat and Mass Transfer
Publisher
Elsevier BV
Volume
176
Pages
111301–111301
Publication date
21 April 2026
Language
EN