Overall geometric optimization of hierarchic manifold microchannel heat sinks for > 3000 W chips with extremely low pumping power consumption
Fields of Study & Subjects
Heat Transfer and Optimization
Parallel Computing and Optimization Techniques
Heat Transfer and Boiling Studies
Publication details
- Journal / source
- International Communications in Heat and Mass Transfer
- Publisher
- Elsevier BV
- Volume
- 178
- Pages
- 111839–111839
- Publication date
- 19 June 2026
- Language
- EN