A unified thermo-viscoplastic phase-field framework for fatigue fracture of solder joints under thermal cycling

International Journal of Fatigue 2026

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Authors: Yutai Su, Zhenrui Zhou, Xujiang Chao, Kun Zhang, Liguo Zhao, Heng Li

DOI: 10.1016/j.ijfatigue.2026.109789

Cited by: 1

References: 53

Fields of Study & Subjects

Numerical methods in engineering High Temperature Alloys and Creep Electronic Packaging and Soldering Technologies

References 53