A high-precision analytical model of transient thermal stresses of through-silicon vias in 3-D integrated circuits

International Journal of Heat and Mass Transfer 2026

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Authors: Luhao Zhai, Junqin Zhang, Guangbao Shan, Xin Jin, W. Y. Chen, Yintang Yang

DOI: 10.1016/j.ijheatmasstransfer.2026.128356

Cited by: 1

References: 42

Fields of Study & Subjects

3D IC and TSV technologies Silicon Carbide Semiconductor Technologies Advancements in Semiconductor Devices and Circuit Design

References 42