Fully diamond-based embedded manifold microchannel heat sink: Achieving ultra-high heat flux cooling

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Authors: Jianyu Du, Xinyi Wei, Haoyang Sun, Shangyang Shi, Jiale Tu, Feng Ji, Junjun Wei, Wei Wang, Chi Zhang
Cited by: 11
References: 41

Fields of Study & Subjects

Heat Transfer and Optimization Thermal properties of materials Microfluidic and Capillary Electrophoresis Applications

Publication details

Journal / source
International Journal of Heat and Mass Transfer
Publisher
Elsevier BV
Volume
260
Pages
128420–128420
Publication date
23 January 2026
Language
EN