Thermoreflectance imaging to characterize Joule heating, current, and junction resistance in silver-nanowire networks
Fields of Study & Subjects
Nanomaterials and Printing Technologies
Electronic Packaging and Soldering Technologies
Copper Interconnects and Reliability
Publication details
- Journal / source
- International Journal of Heat and Mass Transfer
- Publisher
- Elsevier BV
- Volume
- 260
- Pages
- 128426–128426
- Publication date
- 3 February 2026
- Language
- EN