Effect of sintering temperature on the microstructure, composition, and heat transfer of the GaN/diamond interface
Fields of Study & Subjects
GaN-based semiconductor devices and materials
Thermal properties of materials
Metal and Thin Film Mechanics
Publication details
- Journal / source
- International Journal of Heat and Mass Transfer
- Publisher
- Elsevier BV
- Volume
- 260
- Pages
- 128447–128447
- Publication date
- 29 January 2026
- Language
- EN