Topology-optimized thermal cloaks for transient heat conduction
Fields of Study & Subjects
Metamaterials and Metasurfaces Applications
Topological Materials and Phenomena
Topology Optimization in Engineering
Publication details
- Journal / source
- International Journal of Heat and Mass Transfer
- Publisher
- Elsevier BV
- Volume
- 261
- Pages
- 128561–128561
- Publication date
- 19 February 2026
- Language
- EN