Optimization of the thermomechanical reliability of TSV pin-fin microchannels via an electro-thermal-fluid-stress multiphysics coupled model

International Journal of Heat and Mass Transfer 2026

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Authors: Ying Yin, Zhimin Wang, Siyuan Ma, Liang Gong, Yong Li

DOI: 10.1016/j.ijheatmasstransfer.2026.128785

Cited by: 1

References: 46

Fields of Study & Subjects

3D IC and TSV technologies Electronic Packaging and Soldering Technologies Advanced Surface Polishing Techniques

References 46