Modeling and analysis of glass warpage in roll-to-plate hot embossing
Fields of Study & Subjects
Nanofabrication and Lithography Techniques
Advanced Surface Polishing Techniques
3D IC and TSV technologies
Publication details
- Journal / source
- International Journal of Mechanical Sciences
- Publisher
- Elsevier BV
- Volume
- 311
- Pages
- 111187–111187
- Publication date
- 5 January 2026
- Language
- EN