Deformation and damage properties of low temperature SnAgCu-Bi-Sb solder joints

International Journal of Mechanical Sciences 2026

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Authors: Ronit Das, Atif Mahmood, Sai Kiran Reddy Munnangi, Anola Semndili, Sanoop Thekkut, Jones Assiedu, Shantanu Joshi, Gaurav Sharma, Peter Børgesen
DOI: 10.1016/j.ijmecsci.2026.111254
Cited by: 1
References: 60

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Electrical Contact Performance and Analysis Metallurgical and Alloy Processes

Publication details

Journal / source
International Journal of Mechanical Sciences
Publisher
Elsevier BV
Volume
312
Pages
111254–111254
Publication date
14 January 2026
Language
EN