Nonlinear warpage modeling of dielectric-controlled carrier wafers

International Journal of Mechanical Sciences 2026

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Authors: Chang-Yeon Gu, Min-Hyeok Choi, Min Sang Ju, D.G. Kim, D.G. Kim, Sung Woo Ma, Tae-Ik Lee, Taek‐Soo Kim

DOI: 10.1016/j.ijmecsci.2026.111361

Cited by: 1

References: 66

Fields of Study & Subjects

3D IC and TSV technologies Copper Interconnects and Reliability Electronic Packaging and Soldering Technologies

References 66