Vibration–force coupled dynamics and fracture evolution in wafer dicing

International Journal of Mechanical Sciences 2026

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Authors: Jingyu Li, Dingxin Li, Jiao Lin, Chuang Zhang, Jun Cheng

DOI: 10.1016/j.ijmecsci.2026.111581

Cited by: 1

References: 73

Fields of Study & Subjects

Force Microscopy Techniques and Applications Advanced Surface Polishing Techniques Engineering and Materials Science Studies

References 73