Material removal and subsurface damage suppression mechanisms in laser-modified 4H-SiC

International Journal of Mechanical Sciences 2026

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Authors: Qixian Zhang, Changning Bai, Zejin Zhan, Rui Zhen Gao, Rui Chen, Guoqin Huang, Hui Ping Huang, Chunjin Wang

DOI: 10.1016/j.ijmecsci.2026.111875

Cited by: 1

References: 97

Fields of Study & Subjects

Laser Material Processing Techniques Advanced Surface Polishing Techniques Silicon Carbide Semiconductor Technologies

References 97