Deciphering the role of stacking fault energy on TWIP–TRIP interplay in Ni-rich high entropy alloy with tailored Ti content

International Journal of Plasticity 2026

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Authors: Sudhansu Maharana, Sankalp Biswal, Manashi Sabat, D.K.V.D. Prasad, Tapas Laha

DOI: 10.1016/j.ijplas.2026.104642

Cited by: 3

References: 89

Fields of Study & Subjects

High Entropy Alloys Studies Additive Manufacturing Materials and Processes High Temperature Alloys and Creep

References 89