Significant grain refinement and enhanced mechanical behavior of CoNiV medium-entropy alloy wires by Cu microalloying

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Authors: Lin Deng, Ji Luo, Jian Tu, Peter K. Liaw, J.Z. Jiang, Yong Zhang
Cited by: 5
References: 108

Fields of Study & Subjects

High Entropy Alloys Studies High Temperature Alloys and Creep Microstructure and mechanical properties

Publication details

Journal / source
International Journal of Plasticity
Publisher
Elsevier BV
Volume
200
Pages
104673–104673
Publication date
13 March 2026
Language
EN