Stress-induced coupling of electromigration and electrochemical corrosion

International Journal of Solids and Structures 2026

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Authors: Xin-Wei Wu, Mingyang Chen, Liao-Liang Ke
DOI: 10.1016/j.ijsolstr.2026.113948
Cited by: 2
References: 78

Fields of Study & Subjects

Copper Interconnects and Reliability Electronic Packaging and Soldering Technologies Electrodeposition and Electroless Coatings

Publication details

Journal / source
International Journal of Solids and Structures
Publisher
Elsevier BV
Volume
333
Pages
113948–113948
Publication date
12 March 2026
Language
EN