Thermal transport of GaN/substrate heterostructures under non-uniform heat source
Fields of Study & Subjects
Thermal properties of materials
GaN-based semiconductor devices and materials
Silicon Carbide Semiconductor Technologies
Publication details
- Journal / source
- International Journal of Thermal Sciences
- Volume
- 224
- Pages
- 110669–110669
- Publication date
- 12 January 2026
- Language
- EN