An overview of infrared thermography for inspection of solder joint in electronic devices

Infrared Physics & Technology 2026

View at publisher
Authors: Jiayi Yuan, Ze He, Lin Xu, Jinsong Peng, Hector Gutierrez, Lianchao Sheng, Tianchi Chen, Xiangning Lu
DOI: 10.1016/j.infrared.2026.106508
Cited by: 2
References: 61

Fields of Study & Subjects

Thermography and Photoacoustic Techniques Thermal properties of materials Integrated Circuits and Semiconductor Failure Analysis

Publication details

Journal / source
Infrared Physics & Technology
Publisher
Elsevier BV
Volume
155
Pages
106508–106508
Publication date
12 March 2026
Language
EN