Highly accurate deep learning-based thickness and doping parameter extraction of silicon wafer from terahertz transmission spectrum

Infrared Physics & Technology 2026

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Authors: Xiaowei Guo, Yukun Zhou, Hui Huang, Zhiyong Tan
DOI: 10.1016/j.infrared.2026.106606
Cited by: 1
References: 23

Fields of Study & Subjects

Terahertz technology and applications Millimeter-Wave Propagation and Modeling Wireless Signal Modulation Classification

Publication details

Journal / source
Infrared Physics & Technology
Publisher
Elsevier BV
Volume
156
Pages
106606–106606
Publication date
27 April 2026
Language
EN