High conductivity and high strength Cu-Ni-Co-Si alloys with hierarchical nanoscale and microscale precipitates
Fields of Study & Subjects
Microstructure and mechanical properties
Aluminum Alloys Composites Properties
Copper Interconnects and Reliability
Publication details
- Journal / source
- Journal of Alloys and Compounds
- Publisher
- Elsevier BV
- Volume
- 1054
- Pages
- 186321–186321
- Publication date
- 22 January 2026
- Language
- EN