Ultra-dilute electrodeposition of single-crystalline Cu nanostructures for nano-via interconnects

Journal of Alloys and Compounds 2026

View at publisher

Authors: J. I. Lee, Giho Jeong, Jinhee Song

DOI: 10.1016/j.jallcom.2026.186719

Cited by: 0

References: 32

Fields of Study & Subjects

Electrodeposition and Electroless Coatings Copper Interconnects and Reliability Copper-based nanomaterials and applications

References 32