Effect of grain characteristic parameters on strength and electrical conductivity of pure copper prepared by continuously directional solidification

Journal of Alloys and Compounds 2026

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Authors: Shanshan Fu, Ming Wang, Chunlei Gan, Nan Zhou, Valochka Aliaksandr, Lozikov Igor

DOI: 10.1016/j.jallcom.2026.186755

Cited by: 2

References: 44

Fields of Study & Subjects

Microstructure and mechanical properties Copper Interconnects and Reliability Solidification and crystal growth phenomena

References 44