Electric-current-induced grain reorientation in Ni-stabilized η-(Cu, Ni)6Sn5 with stress-decoupled response

Journal of Alloys and Compounds 2026

View at publisher

Authors: Shubhayan Mukherjee, Wan‐Zhen Hsieh, Ming-Wei Hung, Ching-Yu Chiang, Shang-Jui Chiu, Jun Mizuno, Shih-Kang Lin

DOI: 10.1016/j.jallcom.2026.186817

Cited by: 2

References: 43

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Semiconductor materials and interfaces Copper Interconnects and Reliability

References 43