Ni-alloyed Cu@Sn core-shell powders enabling highly efficient and reliable Cu-Cu TLPS bonding: Ni-accelerated Cu₆Sn₅ growth with concomitant Cu₃Sn inhibition

Journal of Alloys and Compounds 2026

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Authors: Wanli Wang, Xianwen Peng, Zheng Ye, Zibo Zhang, jihua huang

DOI: 10.1016/j.jallcom.2026.186873

Cited by: 2

References: 36

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies Aluminum Alloys Composites Properties Powder Metallurgy Techniques and Materials

References 36