Investigation of the mechanical properties of Sn-Bi-In solders for intermediate low-temperature applications

Journal of Alloys and Compounds 2026

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Authors: Hoon Choi, Ju-Hyeon Kim, Hyun-Dong Lee, Seok-Won Lee, Eun-Ho Lee, Byunghoon Lee, Bong-Min Song, Hoo-Jeong Lee

DOI: 10.1016/j.jallcom.2026.187023

Cited by: 5

References: 21

Fields of Study & Subjects

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Semiconductor materials and interfaces

References 21